The company has not yet decided whether it will commit to manufacturing the design as a product. The product would have a chip die size of 179.2mm², read speeds of up to 800MB/s and write speed of 44MB/s. This compares to a die size of 97.6mm² for the Samsung device, which has a read speed of 178MB/s but a write speed of 53MB/s.
Given the four-to-one ratio of Micron’s density compared to today’s planar devices, the company can afford to spend a lot on the new product and still make a profit, Harari said. However, he noted it may require the equivalent of a new fab.Toshiba/SanDisk plan on offering 768Gb TLC 3D BiCS by late 2017 and promise to offer 1Tbit chips in 2018.
The Micron part gets its density from a technique of tucking control circuitry under the array pioneered years ago by Matrix Semiconductor and used by several companies including SanDisk, he added.
“Micron is bold in designing this chip whether they can yield it is another matter,” Harari said.
Source: EE Times