Intel modem inside 50 percent of iPhone 7

Posted on Tuesday, May 17 2016 @ 13:11 CEST by Thomas De Maesschalck

DigiTimes claims Intel's mobile division scored a big design as it will reportedly supply about half of the model chips for use in Apple's upcoming iPhone 7 lineup. Apple is expected to reveal its next-generation phone at an event in September.

Intel will itself package the modem chips for the upcoming new iPhones, but have contracted Taiwan Semiconductor Manufacturing Company (TSMC) and tester King Yuan Electronics (KYEC) to manufacture the chips, the sources said.

About the Author

Thomas De Maesschalck

Thomas has been messing with computer since early childhood and firmly believes the Internet is the best thing since sliced bread. Enjoys playing with new tech, is fascinated by science, and passionate about financial markets. When not behind a computer, he can be found with running shoes on or lifting heavy weights in the weight room.

Loading Comments

Share this story!