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SK Hynix says HBM2 ships in Q3 2016

Posted on Friday, July 15 2016 @ 16:50:21 CEST by


SKHynix logo
South Korean memory maker SK Hynix reveals in a new product catalog that its second-generation High Bandwidth Memory (HBM2) chips is or will be ready for shipment this quarter.

The memory will be offered in a 4 Hi-stack form factor, resulting in a capacity of 4GB per HBM2 chip. There will be two versions:
  • H5VR32ESM4H-20C is a 2Gbps chip with 256GB/s bandwidth per stack
  • H5VR32ESM4H-12C is a 1.6Gbps chip with 204GB/s bandwidth per stack
  • By combining four stacks over a 4096-bit HBM2 bus, video card makers will be able to deliver cards with up to 16GB HBM2.

    HBM implementation

    Source: TPU



     



     

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