SK Hynix says HBM2 ships in Q3 2016

Posted on Friday, July 15 2016 @ 16:50 CEST by Thomas De Maesschalck

South Korean memory maker SK Hynix reveals in a new product catalog that its second-generation High Bandwidth Memory (HBM2) chips is or will be ready for shipment this quarter.

The memory will be offered in a 4 Hi-stack form factor, resulting in a capacity of 4GB per HBM2 chip. There will be two versions:

H5VR32ESM4H-20C is a 2Gbps chip with 256GB/s bandwidth per stack
H5VR32ESM4H-12C is a 1.6Gbps chip with 204GB/s bandwidth per stack

By combining four stacks over a 4096-bit HBM2 bus, video card makers will be able to deliver cards with up to 16GB HBM2.

HBM implementation

Source: TPU

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Thomas De Maesschalck

Thomas has been messing with computer since early childhood and firmly believes the Internet is the best thing since sliced bread. Enjoys playing with new tech, is fascinated by science, and passionate about financial markets. When not behind a computer, he can be found with running shoes on or lifting heavy weights in the weight room.

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