SMIC breaks ground for 300mm fab in Shanghai

Posted on Friday, October 14 2016 @ 13:46 CEST by Thomas De Maesschalck

Chinese foundry SMIC yesterday held a groundbreaking ceremony for its upcoming 300mm fab in Shanghai. The new wafer fab will receive a $10 billion investment and is designed for a monthly capacity of 70,000 wafers.

DigiTimes notes SMIC received "strong support" from China's Ministry of Industry and Information Technology (MIIT) and the Shanghai government to build this plant.

It will be SMIC's second 300mm wafer plant in Shanghai. Furthermore, the company also has one 200mm plant in Shanghai, two 300mm fabs in Beijing, as well as 200mm fabs in Tianjin and Shenzhen.

It's been a while since I last wrote about SMIC. The last report dates from over a year ago, when it was reported that SMIC would offer 14nm FinFET risk production in 2018.

About the Author

Thomas De Maesschalck

Thomas has been messing with computer since early childhood and firmly believes the Internet is the best thing since sliced bread. Enjoys playing with new tech, is fascinated by science, and passionate about financial markets. When not behind a computer, he can be found with running shoes on or lifting heavy weights in the weight room.

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