The leaked slide reveals Intel is working on the 610P series, a new series that uses 3D TLC NAND flash memory made by IMFlash Technology, Intel's joint-venture with Micron. These storage devices will use the M.2 2280 form factor and will utilize PCI Express 3.0 x4 with NVMe support. You can expect the 610P series in Q4 2017 in capacities of 128GB, 256GB, 512GB, 1TB and 2TB.
Intel is also working on a smaller M.2 1620 version for laptops and SFF PCs, this is the 600p BGA family. This model is expected in Q3 2017 in 128GB, 256GB and 512GB editions.
Also planned for Q3 2017 is the Intel SSD 545s, this is a new SATA disk with 3D NAND TLC. You can expect it in a 2.5" version in capacities from 256GB to 2TB, and in a M.2 module with capacities ranging from 256GB to 1TB.
Via: TPU