Posted on Thursday, November 10 2016 @ 14:52 CET by Thomas De Maesschalck
Word from sources at motherboard makers is that Intel plans to integrate WiFi and USB 3.1 functionality in its future motherboard chipsets. DigiTimes
says this will likely be part of the 300-series, which is expected by the end of 2017. The move will be a blow to third-party providers of WiFi and USB 3.1 chips:
The decision is expected impact existing third-party Wi-Fi and USB 3.1 chip makers including Broadcom, which is a major supplier of notebook WLAN chips, Realtek Semiconductor, a major supplier of desktop WLAN chips and ASMedia Technology, which has a major share in the USB 3.1 market.
Although ASMedia is expected to see dropping orders for USB 3.1 host chips, the standardization of USB 3.1 technology will accelerate development of USB 3.1-based devices and increase demand for related chips and 10G signal redrivers and retimers, allowing ASMedia to land new orders.
