TSMC on track for 5nm risk production with EUV in 1H 2019

Taiwanese foundry TSMC told the audience at its annual supply chain management forum that it's on track to deliver risk production of 5nm chips in the first half of 2019.

Co-CEO Mark Liu also reiterated that risk production of 7nm products is slated for the first half of this year, with volume production arriving in 2018.

The first 7nm node from TSMC will not use extreme ultraviolet (EUV) lithography but the foundry plans to incorporate it for an enhanced version of its 7nm process, with full implementation of EUV planned for the 5nm node.

Liu also shared 10nm is coming along nicely for mobile devices:

As for TSMC's 10nm technology focusing mainly on mobile devices, the foundry is gearing up for commercial shipments of chips built using the process later in the first quarter, Liu said. Shipments will expand rapidly in the second half of 2017.