Here are some of the highlights:
NDA press date is 2nd March 9AM CT (slide 2-51) Cinebench Clock-for-Clock (3,5 GHz) R7 1800X 3%/6% slower than i7-6900k/i7-7700k (slide 4) R7 1800X all core boost 3,7 GHz, XFR single core 4,1 GHz (slide 10) R7 1700 confirmed XFR with 50% less headroom (slide 11) X370 required for XFR (slide 11) DDR4 memory support (slide 18):
- 4 DIMM Dual Rank 1866 MHz
- 4 DIMM Single Rank 2133 MHz
- 2 DIMM Dual Rank 2400 MHz
- 2 DIMM Single Rank 2667 MHz
Wraith Stealth/Spire/Max all have a RGB-LED (slide 20) Synthetic Benchmarks Slide 33-36 Gaming Benchmarks Slide 38-42
There's also a slide that details the new Ryzen naming scheme. At the moment we've only seen the standard desktop chips and the high-performance chips with XFR, which have an "X" suffix. Future desktop CPU, APU and mobile releases may get the G, T, S, H, U or M suffix:
There's also a Ryzen delidding video on YouTube from der8auer, it shows AMD used an indium-based solder. So the lesson here is that delidding Ryzen is not necessary, there's little to be gained from it and the odds of breaking your CPU are very high.