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The entire AMD Ryzen press slide deck leaks

Posted on Wednesday, March 01 2017 @ 20:13:23 CET by

AMD logo
Kudos to VideoCardz for spotting this one, the entire AMD Ryzen press slide deck leaks a day before the NDA expires. You can the couple of dozen slides over here.

Here are some of the highlights:
  • NDA press date is 2nd March 9AM CT (slide 2-51)
  • Cinebench Clock-for-Clock (3,5 GHz) R7 1800X 3%/6% slower than i7-6900k/i7-7700k (slide 4)
  • R7 1800X all core boost 3,7 GHz, XFR single core 4,1 GHz (slide 10)
  • R7 1700 confirmed XFR with 50% less headroom (slide 11)
  • X370 required for XFR (slide 11)
  • DDR4 memory support (slide 18):
    - 4 DIMM Dual Rank 1866 MHz
    - 4 DIMM Single Rank 2133 MHz
    - 2 DIMM Dual Rank 2400 MHz
    - 2 DIMM Single Rank 2667 MHz
  • Wraith Stealth/Spire/Max all have a RGB-LED (slide 20)
  • Synthetic Benchmarks Slide 33-36
  • Gaming Benchmarks Slide 38-42
  • AMD Ryzen memory support

    There's also a slide that details the new Ryzen naming scheme. At the moment we've only seen the standard desktop chips and the high-performance chips with XFR, which have an "X" suffix. Future desktop CPU, APU and mobile releases may get the G, T, S, H, U or M suffix:

    AMD Ryzen naming convention

    There's also a Ryzen delidding video on YouTube from der8auer, it shows AMD used an indium-based solder. So the lesson here is that delidding Ryzen is not necessary, there's little to be gained from it and the odds of breaking your CPU are very high.



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