DV Hardware - bringing you the hottest news about processors, graphics cards, Intel, AMD, NVIDIA, hardware and technology!
   Home | News submit | News Archives | Reviews | Articles | Howto's | Advertise
 
DarkVision Hardware - Daily tech news
December 11, 2019 
Main Menu
Home
Info
News archives
Articles
Howto
Reviews
 

Who's Online
There are currently 193 people online.

 

Latest Reviews
Ewin Racing Flash gaming chair
Arctic BioniX F120 and F140 fans
Jaybird Freedom 2 wireless sport headphones
Ewin Racing Champion gaming chair
Zowie P-TF Rough mousepad
Zowie FK mouse
BitFenix Ronin case
Ozone Rage ST headset
 

Follow us
RSS
 

AMD Raven Ridge APUs will use Ryzen branding and more highlights from the AMA

Posted on Friday, March 03 2017 @ 11:55:10 CET by


AMD logo
There was a big Ryzen-themed Ask me Anything (AMA) at Reddit with AMD's Lisa Su, Robert Hallock and James Prior, you can check all the questions and answers over here.

Lets take a look at some of the highlights:
  • AMD confident gaming performance will improve over time by working with the game developers, promises 1080p performance will improve. Su said 300+ developers are working with Zen, and several developers of Ashes of Singularity and Total Warhammer are actively optimizing now.

  • Large team is working on Zen 2. Zen 3 name also mentioned in passing.

  • Ryzen supports ECC memory, but no ECC-REG. It's up to the motherboard maker to support ECC via the BIOS.

  • The upcoming Raven Ridge APUs will use the Ryzen brandname.

  • AMD's Infinity Fabric is used within Ryzen and Vega to connect the IPs together.

  • Laptops and 2-in-1s with Ryzen are expected in second half of 2017.

  • Ryzen has no support for 2P configurations. Zen for workstations will be revealed in the coming months.

  • After seeing interest on Twitter, AMD is looking into a way to get Ryzen hoodies to its fans.

  • AMD is looking into per-core overclocking in BIOS

  • Socket AM4 to be around for a long time, commitment to long-term use and compatibility.

  • Confirmation that Ryzen uses liquid indium solder between die and heatspreader.

  • Support for faster DDR4 speeds expected through BIOS updates, some vendors are already hitting DDR4-3400 reliably. Best results so far with Samsung B-Die DIMMs.

  • Broad availability of Mini-ITX motherboards comes later. It takes the motherboard makers longer to engineer, and there's a smaller market for these boards so it's basic economics.

  • No plans to move to quad-channel memory on Ryzen.




  •  



     

    DV Hardware - Privacy statement
    All logos and trademarks are property of their respective owner.
    The comments are property of their posters, all the rest © 2002-2019 DM Media Group bvba