Now there are some rumors about the Kaby Lake-G series, which is believed to be a BGA processor that could include a graphics chip made using AMD's intellectual property. As you may know, the deal Intel had with NVIDIA expired last month and the rumor mill claims the chip giant closed a deal with AMD. There's a lot of speculation here as AMD nor Intel have confirmed a deal, and we also don't know if this is just an agreement to cover patent litigation issues or a deeper collaboration to put Radeon technology inside Intel CPUs.
For now, rumors peg these Kaby Lake-G as special BGA processors based on Kaby Lake, with an additional discrete GPU on the package. The TDP of these processors (at 65 W and 100 W) is well above the Kaby Lake-H's known 45 Watts. Which begs the question: what exactly is under the hood? This, including Intel's modular approach to chip design for which it developed its EMIB technology, could probably account for the AMD graphic's chip TDP - a discrete-level GPU which would be integrated on-die, EMIB's routing layers handling the data exchange between GPU and processor. This is where HBM 2 memory integration would also come in, naturally - a way to keep a considerable amount of high-speed memory inside the package, accessible by the silicon slices that would need to. Nothing in the leaked information seems to point towards this HBM 2 integration, however.More details can be read at TechPowerUp.