Chinese chip maker Yangtze River Storage Technology is confident it can kick off mass production of its own 64-layer 3D NAND flash memory product in 2019. Backed by billions in government funding, Yangtze River Storage Technology plans to start sampling 32-layer 3D NAND memory by the end of this year and this is just the beginning of the company's aim to become a major player in not only the NAND but also the DRAM market.
One of the company's ambitious goals is to close the NAND technology gap with Samsung by as early as 2020!
YMTC plans to offer samples of its 32-layer 3D NAND products at the end of 2017, and expects to be capable of entering mass production of 64-layer NAND chips in 2019, said Kau. By 2020, YMTC will narrow the technology gap with its bigger rival Samsung Electronics to two years, [Tsinghua Unigroup acting chairman and executive VP Charles]Kau claimed.
YMTC has been enhancing its patent portfolio, and is confident its 3D NAND technology will outperform several rivals' over the next two to three years, Kau indicated.