A look at the TSMC and Samsung process technology roadmap

Posted on Monday, May 08 2017 @ 15:10 CEST by Thomas De Maesschalck
AnandTech published an interesting article that helps you to get up to speed about the upcoming process technologies from Samsung and TSMC. The four-page article discusses what the companies are shipping today and what lies ahead of the current 10nm nodes like TSMC's 7nm and Samsung's 8nm, 7nm and 6nm nodes, as well as the implementation of EUV. Additionally, the author also discusses some upcoming less-advanced nodes that aim to provide better cost-efficiency.
Samsung and TSMC made several important announcements about the present and future of their semiconductor manufacturing technologies in March. Samsung revealed that it had shipped over 70 thousand wafers processed using its first-generation 10 nm FinFET fabrication process (10LPE) and also announced major additions to its upcoming manufacturing technology roadmap. In particular, the company plans to introduce three processes it has not talked about thus far. TSMC said that it is about to start mass production of ICs (integrated circuits) using its first-gen 10 nm technology and also announced several new processes that will be launched in the coming years, including its first 7 nm EUV process due in 2019.
You can read the piece over here.


About the Author

Thomas De Maesschalck

Thomas has been messing with computer since early childhood and firmly believes the Internet is the best thing since sliced bread. Enjoys playing with new tech, is fascinated by science, and passionate about financial markets. When not behind a computer, he can be found with running shoes on or lifting heavy weights in the weight room.



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