TSMC to do 7nm EUV in 2019

Posted on Saturday, May 27 2017 @ 18:54 CEST by Thomas De Maesschalck
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TSMC co-CEO CC Wei revealed the company is on track to offer volume production at its 7nm node in 2018. He also added that an enhanced 7nm process that uses extreme ultraviolet (EUV) production should be ready for mass production in 2019. The same year, TSMC will also be offering a 5nm node.

Here's a brief overview of the processes TSMC offers, it varies based on the intended application:
TSMC will offer its 7nm process technology for mobile products, HPC and automotive applications. The foundry has had 12 7nm tape-outs for mobile devices, and expects to finalize 7nm chip designs for HPC, Wei said.

As for automotive, TSMC's 7nm process will meet the AEC-Q100 (Grade 0) standard in 2018, Wei noted.

TSMC's 5nm node technology will target both the mobile products and HPC applications, with risk production slated for 2019, Wei said.

For IoT applications, TSMC will offer 55nm, 40nm and 28nm ULP processes and expects to have more than 70 customer product designs in 2017, according to Wei.

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