With Skylake-X and Kaby Lake-X, Intel has decided to use a thermal compound/thermal interface material (TIM) to transfer heat from the CPU to the CPU's integrated heat spreader (IHS), allowing Intel to save time and money when manufacturing these new CPUs.
The problems that arise from using non-soldered CPUs occur because the TIM used by Intel will not have the same thermal conductivity as a directly soldered CPU, which will cause Intel's CPUs to run hotter, especially when overclocked.
No solder for the Intel Kaby Lake-X and Skylake-X heatspreader
Posted on Tuesday, May 30 2017 @ 15:18 CEST by Thomas De Maesschalck