DV Hardware bringing you the hottest news about processors, graphics cards, Intel, AMD, NVIDIA, hardware and technology!

   Home | News submit | News Archives | Reviews | Articles | Howto's | Advertise
 
DarkVision Hardware - Daily tech news
August 24, 2017 
Main Menu
Home
Info
News archives
Articles
Howto
Reviews
 

Who's Online
There are currently 67 people online.

 

Latest Reviews
Zowie P-TF Rough mousepad
Zowie FK mouse
BitFenix Ronin case
Ozone Rage ST headset
Lamptron FC-10 SE fan controller
ZOWIE G-TF Rough mousepad
ROCCAT Isku FX gaming keyboard
Prolimatech Magnetic Pin
 

Follow us
RSS
 

No solder for the Intel Kaby Lake-X and Skylake-X heatspreader

Posted on Tuesday, May 30 2017 @ 15:18:31 CEST by


INTC logo
Overclock3D reports overclocker der8auer confirmed at Computex that Intel will not be using a soldered integrated heatspreader (IHS) for its upcoming Skylake-X and Kaby Lake-X processors. This is the first time Intel will not be using solder for their high-end desktop CPUs, a move that will certainly not score them karma points with overclockers and enthusiasts:
With Skylake-X and Kaby Lake-X, Intel has decided to use a thermal compound/thermal interface material (TIM) to transfer heat from the CPU to the CPU's integrated heat spreader (IHS), allowing Intel to save time and money when manufacturing these new CPUs.

The problems that arise from using non-soldered CPUs occur because the TIM used by Intel will not have the same thermal conductivity as a directly soldered CPU, which will cause Intel's CPUs to run hotter, especially when overclocked.




 



 

DV Hardware - Privacy statement
All logos and trademarks are property of their respective owner.
The comments are property of their posters, all the rest © 2002-2017 DM Media Group bvba