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No solder for the Intel Kaby Lake-X and Skylake-X heatspreader

Posted on Tuesday, May 30 2017 @ 15:18:31 CEST by

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Overclock3D reports overclocker der8auer confirmed at Computex that Intel will not be using a soldered integrated heatspreader (IHS) for its upcoming Skylake-X and Kaby Lake-X processors. This is the first time Intel will not be using solder for their high-end desktop CPUs, a move that will certainly not score them karma points with overclockers and enthusiasts:
With Skylake-X and Kaby Lake-X, Intel has decided to use a thermal compound/thermal interface material (TIM) to transfer heat from the CPU to the CPU's integrated heat spreader (IHS), allowing Intel to save time and money when manufacturing these new CPUs.

The problems that arise from using non-soldered CPUs occur because the TIM used by Intel will not have the same thermal conductivity as a directly soldered CPU, which will cause Intel's CPUs to run hotter, especially when overclocked.



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