TSMC making its 7nm process more attractive with 2nd gen InFO packaging

DigiTimes reports TSMC is bringing its second-generation integrated fan-out (InFO) wafer-level packaging technology to its upcoming 7nm FinFET process. The site heard from market watchers that this packaging technology will give TSMC an edge over Samsung, and will make it hard for the latter to regain application processor manufacturing orders for Apple's iPhone.

Samsung has grabbed Apple's A9 chip orders for the new 9.7-inch iPads introduced earlier in 2017, the observers claimed. TSMC, which is already the sole supplier of Apple's 10nm A11 chips for the upcoming iPhones, will still likely obtain all of the next-generation A-series chip orders for Apple's 2018 series of iPhones with its 7nm FinFET process, the observers said.

TSMC's innovation in backend packaging plays a key role in securing exclusive orders for Apple's processors for the upcoming iPhones, the observers noted.