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Intel and Micron ramping up 3D XPoint capacity

Posted on Tuesday, November 14 2017 @ 23:54:24 CET by


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Intel and Micron jointly announced more 3D XPoint memory will soon hit the market as the companies completed an expansion to Building 60 (B60) at the IM Flash facilities in Lehi, Utah. This facility will manufacture 3D XPoint memory, which is used in the Intel Optane disks.
Today, Intel and Micron announced the completion of an expansion to Building 60 (B60) at the IM Flash facilities in Lehi, Utah. The expanded fab will produce 3D XPoint™ memory media, a building block of Intel® Optane™ technology that includes Intel® Optane™ memory for clients, the recently announced Intel® Optane™ SSD 900P Series and new capacities and form factors of the Intel® Optane™ SSD DC P4800X Series. A ribbon-cutting was held at the facility with Utah Gov. Gary Herbert, employees of the facility and representatives from Intel and Micron.

The IM Flash joint venture was created in 2006 to manufacture non-volatile memory for both Intel and Micron, starting with NAND for use in SSDs, phones, tablets and more. In 2015, IM Flash began manufacturing 3D XPoint™ technology, the first entirely new memory media in 25 years. The technology was developed to meet the quickly expanding data needs for all types of customers. 3D XPoint™ technology uses a crosspoint structure to deliver a cell and array architecture that can switch states significantly faster than NAND.




 



 

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