AMD: Zen+ CPUs will have a soldered IHS

Posted on Friday, February 16 2018 @ 10:37 CET by Thomas De Maesschalck

With the launch of the Raven Ridge APUs, news broke that these budget chips use thermal compound instead of solder under the heatspreader. This sparked uncertainty whether this strategy would also be adopted by the upcoming Zen+ based Ryzen 2000 series processors.

We can now put that rumor to test. AMD Technical Marketing guy Robert Hallock confirmed on Reddit that 2nd gen Ryzen processors will use solder. This is preferable as it results in lower temperatures, and higher overclocking potential. It's more expensive though, so that's probably the reason why AMD is using thermal compound for the Raven Ridge parts.

AMD is expected to introduce the 2nd gen Ryzen processors in March 2018. These will be manufactured using the GlobalFoundries 12nm node.

About the Author

Thomas De Maesschalck

Thomas has been messing with computer since early childhood and firmly believes the Internet is the best thing since sliced bread. Enjoys playing with new tech, is fascinated by science, and passionate about financial markets. When not behind a computer, he can be found with running shoes on or lifting heavy weights in the weight room.

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