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ASML EUV machine can handle 140 wafers per hour

Posted on Thursday, March 01 2018 @ 13:05:10 CET by

ASML logo
Dutch semiconductor equipment leader ASML announced its NXE 3400B system for extreme ultraviolet (EUV) lithography is now capable of producing 140 wafers per hour with a 245W light source. This means the company is closing in on its goal of tuning the system for throughput of 150 wafers per hour with a 250W light source. These systems are expected to ship to customers before June for use on 7nm nodes.
The company targets a greater-than-90% uptime for the system by 2018–2019, when it should be in volume production. A day earlier, a Globalfoundries executive said that productivity levels were the key gating item on the first commercial use of the systems.

To meet the needs of 5-nm nodes, ASML plans three upgrades to the system delivered over the next two years.

Late this year, ASML aims to deliver a so-called overall and focus improvement package that enables overlays down to 1.7 nm, slightly below the required 1.9-nm target for 5 nm. In mid-2019, it plans a productivity enhancement package that boosts throughput to 145 WPH.
More details at EE Times, they have a complete picture about ASML's latest EUV plans.



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