ASML EUV machine can handle 140 wafers per hour

Posted on Thursday, March 01 2018 @ 13:05 CET by Thomas De Maesschalck
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Dutch semiconductor equipment leader ASML announced its NXE 3400B system for extreme ultraviolet (EUV) lithography is now capable of producing 140 wafers per hour with a 245W light source. This means the company is closing in on its goal of tuning the system for throughput of 150 wafers per hour with a 250W light source. These systems are expected to ship to customers before June for use on 7nm nodes.
The company targets a greater-than-90% uptime for the system by 2018–2019, when it should be in volume production. A day earlier, a Globalfoundries executive said that productivity levels were the key gating item on the first commercial use of the systems.

To meet the needs of 5-nm nodes, ASML plans three upgrades to the system delivered over the next two years.

Late this year, ASML aims to deliver a so-called overall and focus improvement package that enables overlays down to 1.7 nm, slightly below the required 1.9-nm target for 5 nm. In mid-2019, it plans a productivity enhancement package that boosts throughput to 145 WPH.
More details at EE Times, they have a complete picture about ASML's latest EUV plans.


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Thomas De Maesschalck

Thomas has been messing with computer since early childhood and firmly believes the Internet is the best thing since sliced bread. Enjoys playing with new tech, is fascinated by science, and passionate about financial markets. When not behind a computer, he can be found with running shoes on or lifting heavy weights in the weight room.



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