Posted on Friday, April 06 2018 @ 22:56 CEST by Thomas De Maesschalck
Here's a quick overview as it's quite a lot to process:
Intel's Tiger Lake has very low idle power. Intel is using the power management from Lakefield, promises extremely low standby power of just 9mW. Apple executives were reportedly "surprised" by the 35W Tiger Lake's 9mW standby power. TechPowerUp did a writeup on this and compares this to ARM's big.LITTLE design. Tiger Lake is the successor of Ice Lake, which will succeed the current Coffee Lake generation.
The 10nm+ Icelake-SP is planned for 2019.
Sapphire Rapids is a 2020 product, made on the 10++ node.
Intel Knights Crest will be made in-house, but Spring Crest will be fabbed by TSMC.
Spring Hill is a deep learning inference product
Embedded Multi-Die Interconnect Bridge (EMIB) will be succeeded by "Fevoros", this new tech will enable the packaging of smaller dies as well as 3D stacking (chip on top of chip). EMIB will be used through Sapphire Rapids. Post-Sapphire Rapids (Granite Rapids and beyond) will be "Fevoros".
Intel has three 10nm generations: 10nm, 10nm+ and 10nm++. After 10++ we get 7nm.
Arctic Sound was originally intended for video streaming in datacenters. Raja Koduri redefined Intel's first new discrete GPU to also enter the gaming market with a bang. Arctic Sound could be a multi-chip package, with configurations of two and four dies. Intel reportedly targets performance/Watt leadership under 60W. Expected launch date is the first half of 2020.
