Intel Ice Lake Xeon uses LGA4189, has up to 230W TDP and eight-channel DDR4

Posted on Tuesday, April 10 2018 @ 14:00 CEST by Thomas De Maesschalck
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The Power Stamp Alliance revealed some interesting details about Intel's future Ice Lake Xeon platform. It appears the chip giant will introduce a new socket with this platform, it will use LGA4189 instead of the current LGA3647 socket. Cascade Lake is expected later this year while the first Ice Lake server parts are expected in the 2018/2019 timeframe.

One of the first interesting observations is that Ice Lake server parts will have a TDP of up to 230W, which is quite a bit more than the up to 205W TDP of Skylake and Cascade Lake. Part of this is due to the inclusion of new features like OmniPath and on-package FPGAs.

We also learn the Ice Lake server platform will offer native eight-channel DDR4 memory support and there's some information about the adoption of a 48V bus. You can learn more at AnandTech.

Ice Lake Xeon power stamp alliance specs


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Thomas De Maesschalck

Thomas has been messing with computer since early childhood and firmly believes the Internet is the best thing since sliced bread. Enjoys playing with new tech, is fascinated by science, and passionate about financial markets. When not behind a computer, he can be found with running shoes on or lifting heavy weights in the weight room.



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