The 96-layer BiCS4 lineup from WD will include both TLC and QLC NAND flash memory chips, with capacities ranging from 256Gb to 1Tb. Previous company statements indicated it would first do 256Gb 3D TLC NAND flash, before moving to higher-capacity 3D TLC and eventually 3D QLC chips with a capacity of up to 1Tb. More details about WD's NAND roadmap can be learned at AnandTech.
WD is now shipping 96-layer 3D NAND to customers
Posted on Wednesday, May 30 2018 @ 13:20 CEST by Thomas De Maesschalck
The 96-layer BiCS4 lineup from WD will include both TLC and QLC NAND flash memory chips, with capacities ranging from 256Gb to 1Tb. Previous company statements indicated it would first do 256Gb 3D TLC NAND flash, before moving to higher-capacity 3D TLC and eventually 3D QLC chips with a capacity of up to 1Tb. More details about WD's NAND roadmap can be learned at AnandTech.