Yangtze Memory Technologies to present details about it 3D NAND

Later this week, Chinese memory firm Yangtze Memory Technologies will present details about its 3D NAND flash memory technology at the Flash Memory Summit. This will be the first public discussion of China's plan to make cutting-edge memory chips. YTMC is China's leading homegrown memory maker, the firm is expected to start shipping 48-layer 3D NAND later this year. This puts it up to two steps behind its bigger global rivals. Full details at EE Times.

YTMC will describe what it calls Xtacking as an approach to 3D NAND that delivers a “speed-up to DRAM DDR4 while delivering industry-leading bit density, marking a quantum leap for the NAND market.” Xtacking “enables parallel processing of the NAND array and periphery … a modular approach [that will] shorten the time-to-market for new generations of 3D NAND and open the possibility for customized NAND flash products,” according to a press statement.

The company, described as the pride of China, has long been seen as one of the country’s most likely candidates to deliver a commercially viable mainstream memory chip. It was founded in 2016 with a whopping $24 billion in funding, leveraging the 12-inch fabs of China’s XMC in Wuhan.