TSMC believes new tech can accelerate chip scaling

Posted on Wednesday, Sep 12 2018 @ 11:21 CEST by Thomas De Maesschalck
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Taiwanese foundry TSMC doesn't believe in a slowdown of chip scaling. At a recent industry event in Taiwan, chairman Mark Liu said new technology can allow chip scaling to double each year. While Moore's Law is no longer dictating the industry as it used to do, Liu sees opportunities in "true" 3D ICs that integrate memory and logic, new transistor materials, more advanced chip stacking, and new hardware/software co-design.
“The future of the semiconductor industry has never been so bright,” said Liu in a presentation at the Semicon event.


“Scaling will continue to 3 nm and 2 nm,” said Liu. “This will happen with EUV and new transistor structures like FinFET and new materials like high-k metal gate. EUV shows that lithography is no longer the limiting factor in scaling.”

New materials such as germanium graphene and molybdenum disulfide will also help boost transistor density in the future, he said.
Via: EE Times

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Thomas De Maesschalck

Thomas has been messing with computer since early childhood and firmly believes the Internet is the best thing since sliced bread. Enjoys playing with new tech, is fascinated by science, and passionate about financial markets. When not behind a computer, he can be found with running shoes on or lifting heavy weights in the weight room.

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