“The future of the semiconductor industry has never been so bright,” said Liu in a presentation at the Semicon event.Via: EE Times
“Scaling will continue to 3 nm and 2 nm,” said Liu. “This will happen with EUV and new transistor structures like FinFET and new materials like high-k metal gate. EUV shows that lithography is no longer the limiting factor in scaling.”
New materials such as germanium graphene and molybdenum disulfide will also help boost transistor density in the future, he said.
TSMC believes new tech can accelerate chip scaling
Posted on Wednesday, Sep 12 2018 @ 11:21 CEST by Thomas De Maesschalck