Posted on Monday, September 17 2018 @ 14:27 CEST by Thomas De MaesschalckAlthough AdoredTV initially believed information that Rome would be a 5 die design, with 4 CPU dies and 1 IO die for a total of 48 or 64 cores (depending on whether or not AMD increased core counts on every die to 12 or 16 cores), he states that the 8 die design is more likely. His reasoning being that, the smaller the die, the greater the amount of yields, and when yields are higher on a wafer, it is more likely to find better cores than on a wafer used for a larger die. The analyst cited a research paper conducted on the viability of "chiplets," and idea of splitting up a large die into several smaller dies; the paper found that yields, average clock speed, and power efficiency was improved the closer the core count was to 1 core per die. AdoredTV speculates that the Zen 2 die will use the same layout as Zen 1 and +: two CCXs of 4 cores each.Intel's server division is working on Cooper Lake, that architecture will allegedly feature up to three dies, two CPU dies and one I/O die for a total of 56 cores. But it seems Intel will have to pull quite a feat to keep EPYC at bay:
Cooper Lake will be fabbed on a 14nm process from Intel, either 14nm++ or an enhanced 14nm++ process (referred to as "14nm+++"), speculates AdoredTV. The tech analyst, however, has serious doubts about the Cooper Lake architecture and the process it is to be manufactured on, saying, "[Intel] will have to do everything they can do stave off Zen 2."If the rumors and speculation from AdoredTV is accurate, it means the core count of AMD's and Intel's server processors will double next year, versus current maximum core counts of 32 and 28 cores, respectively.
Via: NotebookCheck
