China to mass produce 64-layer 3D NAND in Q4 2019

Posted on Thursday, September 20 2018 @ 14:30 CEST by Thomas De Maesschalck

Yangtze Memory Technologies (YMTC) CEO Simon Yang revealed the Chinese memory firm aims to kick off volume production of 64-layer 3D NAND flash memory in the final quarter of 2019. Monthly production of YMTC is expected to hit 100,000 wafers once it achieves mass production of its 64-layer 3D NAND.

Yang claims YMTC has no intention of disrupting the NAND chip market, he points out the company is pursuing profit growth. At the moment, YMTC's product gross margin is negative, but the rollout of the 64-layer technology should enable the company to turn margins to positive.

Given its more competitive cost structure, YMTC's next-generation 64-layer 3D NAND technology will be the company's focus, Yang noted. The company has also developed its own 3D NAND technology, dubbed Xtacking, with the availability of engineering samples, Yang said. YMTC's Xtacking technology was unveiled at the Flash Memory Summit in the US in August.

Via: DigiTimes

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Thomas De Maesschalck

Thomas has been messing with computer since early childhood and firmly believes the Internet is the best thing since sliced bread. Enjoys playing with new tech, is fascinated by science, and passionate about financial markets. When not behind a computer, he can be found with running shoes on or lifting heavy weights in the weight room.

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