Samsung Electronics has boosted its 3D NAND manufacturing to 85% as a proportion of its total NAND chip output, the observers said. Toshiba with its technology partner Western Digital also has as high as 75% of output using 3D NAND process technology, the observers indicated.The move to 3D NAND will also result in higher storage capacities. Next year, flagship smartphones are expected to feature a capacity of 512GB.
Micron Technology and SK Hynix have had 90% and 60%, respectively, of their total NAND chip output built using 3D NAND technology, the observers said.
In addition, these major NAND chip vendors will have new production lines come online in 2019, while China-based startups such as Yangtze Memory Technologies (YMTC) will also start running their new fabs, the observers suggested. As a result, the global NAND flash bit output will continue growing to drag down memory prices further, the observers said.
3D NAND now makes up over 60 percent of NAND bit output
Posted on Tuesday, September 25 2018 @ 12:02 CEST by Thomas De Maesschalck
Industry observers told DigiTimes that 3D NAND flash memory technology now makes up in excess of 60 percent of global NAND flash bit output. The site adds that NAND flash prices have dropped 40 percent this year, as major vendors migrated to 3D NAND manufacturing.