Posted on Wednesday, September 26 2018 @ 13:38 CEST by Thomas De Maesschalck
TSMC is planning a new factory in Chunan, Miaoli (northern Taiwan) for advanced packaging technologies. DigiTimes
reports that in the 2.5D/3D IC packaging segment, TSMC is now capable of processing 200,000 wafers a month using its in-house CoWoS technology.
TSMC's new advanced packaging plant is expected to accelerate the foundry's IC backend business expansion, according to industry sources. TSMC has been enhancing its backend packaging capability to strengthen its competitiveness in the sub-10nm process segment.
TSMC's new advanced packaging fab will fulfill mainly orders demanding the foundry's CoWoS (chip-on-wafer-on-substrate) and integrated fan-out (InFO) wafer-level packaging, and its newly-unveiled system-on-integrated-chips (SoIC) and wafer-on-wafer (WoW) packaging services, the sources indicated.
