ASML aims to ship EUV machine with 155 wafer per hour capacity in 2019

Dutch semiconductor manufacturing equipment maker ASML announced it plans to ship its NXE:3400C EUV machines in 2019. These machines aim to offer a capacity of more than 155 wafers per hour, whereas the current generation can handle just 125 wafers per hour.

Here's the statement from ASML's third-quarter financial report:

We shipped and recognized revenue for five EUV systems in the third quarter. In addition, we received five EUV orders. We expect to ship a total of 18 EUV systems this year. Our 2019 shipment plan is 30 systems as the first customers are about to start high volume production using EUV. We have made significant progress in the execution of our roadmap, accelerating the introduction of the higher-productivity system NXE:3400C, offering more than 155 wafers per hour. Shipment of this system is expected to start in the second half of 2019.

We currently see strong demand for our products in Logic and Memory continuing in 2019, which supports our Logic customers' advanced nodes production schedule. In the Memory segment, we see strong momentum continuing, as evidenced by our Q3 order intake," said ASML President and Chief Executive Officer Peter Wennink.

ASML expects to ship a total of 18 EUV machines this year, and aims to ship another 30 in 2019. TSMC plans to use EUV for its second-generation 7nm node in 2019.