The South Korean giant also revealed a new 512Gb QLC flash memory chip die will be added to the lineup in Q2 2019. This chip promises higher performance than the current 1Tb die:
Samsung also mentioned that in Q2 2019 they are planning to introduce a higher-performing 512Gb QLC die to complement their current 1Tb die. Samsung compared the performance of this new 512Gb die against an unspecified competitor's 1Tb QLC, claiming that Samsung's high-performance QLC will have 37% lower read latency and 45% lower program latency. Their slides suggested that the performance differences relative to Samsung's own 1Tb part could be even larger, but Samsung did not quantify this.AnandTech has the full overview over here.