YMTC to skip 96-layer 3D NAND in favor of 128-layers

Posted on Wednesday, November 14 2018 @ 14:00 CET by Thomas De Maesschalck

Yangtze Memory Technology (YMTC) is now sampling its first 64-layer 3D NAND memory chips. Volume production of these chips is expected to commence in Q3 2019. As you may know, YMTC is a state-backed Chinese memory maker, it aims to become the country's first mass producer of memory chips.

Interestingly, it seems YMTC has no intention of making 96-layer 3D NAND memory. Anonymous sources cited by DigiTimes claim the company intends to jump straight to 128-layers. According to the report, YMTC aims to offer 128-layer 3D NAND volume production in 2020. This may help the firm to narrow the gap with world's leading NAND makers.

YMTC's in-house developed Xtacking architecture is already adopted in the company's 64-layer 3D NAND engineering samples. Xtacking enables YMTC's 64-layer 3D NAND to be competitive with the available 96-layer 3D NAND solutions, the sources continued.

YMTC CEO Simon Yang was quoted in previous reports that the company is set to enter volume production of 64-layer 3D NAND flash memory in the fourth quarter of 2019. Yang added YMTC's 32-layer 3D NAND process technology is pretty mature and has been involved in production for small-volume orders.

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Thomas De Maesschalck

Thomas has been messing with computer since early childhood and firmly believes the Internet is the best thing since sliced bread. Enjoys playing with new tech, is fascinated by science, and passionate about financial markets. When not behind a computer, he can be found with running shoes on or lifting heavy weights in the weight room.

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