Posted on Thursday, December 27 2018 @ 12:40 CET by Thomas De Maesschalck
DigiTimes
picked up news that Huawei is expected to be the first first to adopt TSMC's 7nm process with extreme ultraviolet (EUV). EUV is the next big step in semiconductor manufacturing, it replaces the traditional immersion lithography, which has reached the limits of what's physically possible.
Huawei through its chip subsidiary HiSilicon will be TSMC's first customer adopting the foundry's N7 Plus and N5 fabrication processes, said the report, without citing its source.
According to TSMC, both its N7 Plus and N5 processes will incorporate EUV lithography technology. The foundry is scheduled to move the N7 Plus to volume production in the first quarter of 2019, and targets 2020 for volume production of the N5.
