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Intel: 10nm Ice Lake to be in stores by late 2019

Posted on Tuesday, January 08 2019 @ 10:00:57 CET by

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Over at CES 2019, Intel announced its next-generation 10nm Ice Lake processors will hit the retail market by holiday 2019. These chips are based on the new Sunny Cove microarchitecture and feature Gen11 graphics. Ice Lake will integrate Thunderbolt 3 technology and will also support WiFi 802.11ax. The chip giant also added more CPUs to its 9th Gen Core lineup, and previewed "Lakefield", a future architecture that will use Foveros 3D packaging technology to combine different cores.
  • New mobile PC platform with "Ice Lake": The vision for tomorrow's mobile PC platform is firmly aligned with Intel's upcoming first volume 10nm PC processor, code-named "Ice Lake." Ice Lake brings a new level of integration with Intel's new Sunny Cove microarchitecture, instruction sets to accelerate AI usage and a graphics engine, and Intel Gen11 graphics to improve graphics performance for richer gaming and content creation experiences. Intel's OEM partners are expected to have new devices with Ice Lake on shelves by holiday 2019.

  • Project Athena: Intel also announced Project Athena, an innovation program and new set of industry specifications developed to help usher in a new class of advanced laptops designed to enable new experiences and capitalize on next-generation technologies, including 5G and artificial intelligence. From delivering the first connected PC with integrated Wi-Fi in the Intel® Centrino® platform to driving mainstream adoption of super thin and light designs, touchscreens, and 2 in 1 form factors with Ultrabook™, Intel is uniquely positioned to be the catalyst in delivering the next-gen PC experience. Combining world-class performance, battery life and connectivity in sleek, beautiful designs, the first Project Athena devices are expected to be available in the second half of this year.

  • "Lakefield" preview: Intel is accelerating client innovation by taking new approaches to hybrid CPU architecture and packaging technologies. At CES 2019, Intel provided a sneak peek of a new client platform, code-named "Lakefield," featuring the first iteration of its Foveros 3D packaging technology. This hybrid CPU architecture enables combining different pieces of IP that might have previously been discrete into a single product with a smaller motherboard footprint, which allows OEMs more flexibility for thin and light form factor design. Lakefield is expected to be in production this year.

  • Expanding 9thGen Intel® Core™ desktop family: Intel introduced new additions to the 9th Gen Intel Core processors that expand the family for a broader spectrum of desktop products. These processors deliver world-class performance to unlock incredible new capabilities and experiences for content creators and gamers at all levels. The first of the new 9th Gen Intel Core desktop processors is expected to be available starting this month.
  • On a related note, Intel is now also shipping its "Cascade Lake" Intel Xeon Scalable CPUs for revenue, and the chip giant demonstrated its future 10nm "Ice Lake" server CPUs.



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