TSMC will start fabricating HiSilicon's new-generation flagship mobile SoC in the second quarter, said the report, without citing its source. The upcoming Kirin 985 series chips will be built using TSMC's 7nm incorporating EUV, dubbed N7+, the report indicated.TSMC is also doing 5nm risk production and is expected to tape out several 5nm chips this year.
In addition, TSMC will introduce an enhanced version of its N7+ for the fabrication of Apple's custom-designed A13 chip that will power the 2019 series of iPhones, the report continued. Dubbed N7 Pro, the process will be ready for volume production later in the second quarter, the report added.
TSMC 7nm EUV production to start this quarter
Posted on Monday, Apr 15 2019 @ 11:52 CEST by Thomas De Maesschalck