ASML: New EUV machines to hit 170 wafers per hour in 2H 2019

Posted on Wednesday, Apr 17 2019 @ 11:11 CEST by Thomas De Maesschalck
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Foundries are starting to adopt EUV and Dutch semiconductor equipment maker ASML is doing its best to make better machines as fast as possible. In a new statement, ASML revealed it plans to ship its NXE:3400C machines in the second half of this year.

This new EUV machine promises a throughput of 170 wafers per hour:
For EUV, the first set of NXE:3400C optics are in the factory. These higher transmission optics will enable the higher throughput of 170 wafers per hour. This is expected to deliver cost effective shrink for both Logic and DRAM. The system is expected to be available to our customers in the second half of 2019.
EUV is the next big thing in the production of semiconductors. It's been long-delayed, but now it's a necessity as traditional immersion lithography has hit the limits of what's physically possible.

About the Author

Thomas De Maesschalck

Thomas has been messing with computer since early childhood and firmly believes the Internet is the best thing since sliced bread. Enjoys playing with new tech, is fascinated by science, and passionate about financial markets. When not behind a computer, he can be found with running shoes on or lifting heavy weights in the weight room.

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