This new EUV machine promises a throughput of 170 wafers per hour:
For EUV, the first set of NXE:3400C optics are in the factory. These higher transmission optics will enable the higher throughput of 170 wafers per hour. This is expected to deliver cost effective shrink for both Logic and DRAM. The system is expected to be available to our customers in the second half of 2019.EUV is the next big thing in the production of semiconductors. It's been long-delayed, but now it's a necessity as traditional immersion lithography has hit the limits of what's physically possible.