Posted on Monday, April 29 2019 @ 10:46 CEST by Thomas De Maesschalck
In response to lower sales to the server segment, as well as higher inventory, SK Hynix announced a 10 percent cut to its NAND flash memory wafer production versus 2018. Total NAND bit production will still increase though, due to higher capacities being shipped.
Meanwhile SK Hynix this week said that it had stopped production of 36-layer as well as 48-layer 3D NAND memory, which these days has a rather high per-bit cost relative to newer technologies. In the coming months the company plans to increase production of 72-layer 3D NAND and in the second half of the year it intends to release 96-layer 3D NAND solutions for the SSD and mobile markets. Furthermore, SK Hynix will slow down the ramp up of its M15 fab in Cheongju, South Korea. The company expects its NAND wafer output to decrease more than 10% compared to 2018. Just like Micron, SK Hynix does not seem to have plans to lower its NAND bit production, so it will still more memory than it did last year.
Via: AnandTech
