TSMC forecast that its total managed capacity will amount to 12 million 12-inch equivalent wafers in 2019, with capacity for 7nm process technology to jump 150% on year to one million units.Via: DigiTimes
TSMC is also on track to move a newer 5nm process node to volume production in the first quarter of 2020, according to Kevin Zhang, company VP of business development. TSMC adopts EUV extensively in its 5nm technology, and has already moved the node to risk production.
TSMC 7nm EUV has entered mass production
Posted on Friday, May 24 2019 @ 14:37 CEST by Thomas De Maesschalck