TSMC revealed it's now doing volume production of chips built using its 7nm N7+ process technology, which is the Taiwanese foundry's first node to use extreme ultraviolet (EUV) lithography. The company says yields of the N7+ node are "on par" with those achieves on the N7 process.
TSMC forecast that its total managed capacity will amount to 12 million 12-inch equivalent wafers in 2019, with capacity for 7nm process technology to jump 150% on year to one million units.
TSMC is also on track to move a newer 5nm process node to volume production in the first quarter of 2020, according to Kevin Zhang, company VP of business development. TSMC adopts EUV extensively in its 5nm technology, and has already moved the node to risk production.