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AMD: Zen 2-based Ryzen 3000 series has soldered IHS

Posted on Sunday, June 02 2019 @ 17:20:43 CEST by


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Via Twitter, AMD senior technical marketing manager Robert Hallock confirmed that the upcoming "Matisse" Ryzen 3000 series processors will feature a soldered heatspreader.
Soldering as an interface material is preferred as it offers better heat transfer between the processor die and the IHS, as opposed to using a fluid TIM such as pastes. "Matisse" will be one of the rare few examples of a multi-chip module with a soldered IHS. The package has two kinds of dies, one or two 7 nm "Zen 2" 8-core CPU chiplets, and one 14 nm I/O Controller die.




 



 

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