TSMC 3nm EUV development is going well

Posted on Wednesday, July 24 2019 @ 13:56 CEST by Thomas De Maesschalck
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During a recent conference call, TSMC CEO C.C. Wei told investors that the development of its N3 process is going well. The Taiwanese foundry is already engaging with early customers on the technology definition of its 3nm EUV node, and expects this process will further extend its leadership position in the foundry business.
Since its N3 technology is in its early stages of development, TSMC doesn't currently talk about the specific characteristics of the process nor its advantages over N5. TSMC said that it had evaluated all possible transistor structure options for 3nm and came out with ‘a very good solution’ for its clients. The specification is under development and the company is confident it would meet requirements of its leading partnering customer.
TSMC's 3nm process is expected to be ready for mass production in 2022. The foundry expects its 5nm node will be ready next year.

Via: AnandTech


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Thomas De Maesschalck

Thomas has been messing with computer since early childhood and firmly believes the Internet is the best thing since sliced bread. Enjoys playing with new tech, is fascinated by science, and passionate about financial markets. When not behind a computer, he can be found with running shoes on or lifting heavy weights in the weight room.



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