Chinese memory maker Yangtze Memory Technologies (YMTC) is now doing volume production of 64-layer 256Gb 3D NAND memory chips. DigiTimes heard YMTC has gradually improved its 64-layer 3D NAND yields. The state-backed Chinese company is expected to grow its 64-layer 3D NAND flash memory output to 100,000-150,000 wafers monthly in 2020.
YMTC plays a key role in China's memory ambitions. State-owned Tsinghua Unigroup, the parent company of YMTC, is also constructing a factory site in Chengdu to house 12-inch fabrication lines for 3D NAND wafers, the sources noted. The new site is expected to come online in 2021-2022, with initial production capacity of 100,000 wafers a month.
YMTC will skip 96-layer 3D NAND and is expected to jump straight to 128-layer NAND production in the second half of 2020. If the company succeeds, this will put it on the same footing as other NAND makers like Samsung, SK Hynix, Toshiba Memory, Intel, and Micron.