In the 3DMark benchmark database, Twitter user TUM_APISAK spotted a 5-core Lakefield processor from Intel. The chip has a reported stock clock of 3.1GHz and it's believed to be one of the first chips that uses Foveros 3D packaging.
Tom's Hardware points out that Lakefield will use a design similar to the ARM big.LITTLE architecture. You get a powerful big core as well as several smaller, slower, and more energy-efficient cores.
In Lakefield's case, Intel plans to endow the processor with one Sunny Cove core and four accompanying Atom Tremont cores. The chipmaker will cook up Lakefield chips with a combination of manufacturing process. Intel uses the 10nm node for the compute die and the 22nm node for the base die.
Lakefield will be offered in 5W and 7W TDP versions and is expected to hit production in Q4 2019, with product launches in 2020.