One of the first products to use Samsung’s 12-layer DRAM packaging technology will be the company’s 24 GB HBM2 KGSDs that will be mass produced shortly. These devices will allow developers of CPUs, GPUs, and FPGAs to install 48 GB or 96 GB of memory in case of 2048 or 4096-bit buses, respectively. It also allows for 12 GB and 6 GB stacks with less dense configurations.Via: AnandTech
Samsung did not disclose how much will 12-layer 24 GB HBM2 devices cost, but since they will be available exclusively from Samsung, we expect the manufacturer to charge a premium.
Samsung 12-layer 3D TSV DRAM enables 24GB HBM2
Posted on Tuesday, October 08 2019 @ 13:56 CEST by Thomas De Maesschalck