. A picture of the land-grid of an LGA1200 package also leaked to the web, showing how Intel utilized empty bits of the fiberglass substrate to cram in the additional 49 pins, without changing the size of the contacts.LGA1200 debuts with Comet Lake-S and the 400-series motherboards, which are expected to be out in Q2 2020.
Socket H5 | Socket H4 pic.twitter.com/VY4V3GOjii
— 188? (@momomo_us) 23 december 2019