Intel Project Athena laptops to have more cooling headroom

At next month's CES 2020 show, Intel will reveal a new thermal module design for "Project Athena" laptops. The new design promises 25 to 30 percent extra cooling headroom, which should result in laptops that run cooler. The thermal module will feature both vapor chambers and graphite sheets to dissipate heat more efficiently.

Interestingly, Intel decided to move the heat dissipation area to the laptop cover. A new hinge design will connect the vapor chamber to graphite heat dissipation sheets placed behind the laptop screen:

The vapor chamber will replace all the current modules and connect to graphite sheets placed behind the laptop screen, where a lot of area is available. Connecting the vapor chamber to the graphite sheet is a laptop hinge, where a graphite cooling solution would pass through. This hints at a complete redesign of laptop hinges, so we can expect to see some creative solutions there as well.

Via: TechPowerUp