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The future of the chip interconnect

Posted on Monday, January 06 2020 @ 13:44:33 CET by


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AnandTech sat down with Intel's Ramune Nagisetty to discuss the future of interconnect technology, like what the chip giant is trying to achieve with Foveros. You can read the full interview over here.
DS: Earlier this year Intel disclosed that it shipped its 2 millionth EMIB product. Do you see EMIB making its way into the mainstream desktop market, where you’re shipping 10+ million products, rather than just the high-end low volume hardware?

RN: Yes absolutely. Actually that’s the advantage of EMIB compared to some of these other integration schemes – the cost is in the volume, and that makes it manageable. That’s the kind of volume we want in order to amortize these costs.




 



 

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