All Intel-based ASUS ROG laptops get liquid metal compound

ASUS announces that its full 2020 lineup of ROG gaming laptops with 10th Gen Intel Core processors will feature liquid metal compound. The company says this new production process is the result of more than a year of development. Previously, liquid metal was primarily used by overclockers and enthusiasts. ASUS has been able to figure out a way to make liquid metal compound suitable for mass production. You can read the full story at the ROG blog.

Liquid metals have low melting points that render them fluid at room temperature. These alloys are highly conductive, so they’re extremely effective at transferring thermal energy between surfaces like a processor die and heatsink. The benefits are well-established in overclocking and DIY circles, and internal testing reinforced the appeal for gaming laptops. Our engineers observed a 10~20°C reduction in temperatures depending on the CPU.

The improved thermal interface creates margin that can be used in different ways. Lower temperatures help processors sustain higher clock speeds for longer, and also prevent fans from ramping up to louder RPMs. The additional thermal headroom can also be used to reach even faster frequencies and higher performance.

The piece explains the company is still working on a way to use it for AMD-based systems. ASUS says Intel processors are better suited for its current production process because they have a small die that's surrounded by a safe zone on the CPU package that's free of surface-mounted components. AMD processors on the other hand have surface-mounted circuitry that's prone to shorting upon accidental contact with the liquid metal compound. ASUS is trying to use new insulation techniques to overcome this issue.