Retired Engineer previously correctly predicted that AMD's Matisse would be a multi-chip module with core and uncore dies fabbed on different nodes. Now he writes that Intel's Rocket Lake-S may feature a 14nm die that features the CPU cores, and a 10nm die that features the Gen12 integrated graphics the DDR4 memory controller, a PCIe 4.0 controller and other uncore parts.
The 14 nm CPU die on "Rocket Lake-S" holds "Willow Cove" CPU cores that are purported to introduce significant IPC gains over "Skylake." In this die, there are CPU cores and a reduced-functionality system agent, which are bound together by a Ring-bus interconnect. This system agent talks to its counterpart on the uncore die (aka "GPU die"), over EMIB interconnect.I guess we'll find out more later this year. Rocket Lake-S is expected before the end of the year, although some recent rumors indicate the chip may be delayed to 2021.
The 10 nm GPU die (aka uncore die) features the processor's Gen12 Xe iGPU with up to 96 execution units, a dual-channel DDR4 memory controller, and a PCI-Express 4.0 root-complex, besides other minor components related to the iGPU, such as its display- and media engines.