A deep dive into the Intel Lakefield

Posted on Tuesday, July 07 2020 @ 14:07 CEST by Thomas De Maesschalck
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Lakefield is Intel's first hybrid processor, the chip uses Foveros 3D stacking to pack a 10nm Sunny Cove core as well as four 10nm Tremont cores on a 22nm interposer. But how does this all work, and what are the implications for the future? Find out at AnandTech.
In this article, over the following pages, we'll be looking at Intel's new Lakefield processor in detail, covering the new multi-core design, discussing chiplets and Intel's new die-to-die bonding technology called Foveros, the implications of such a design on laptop size (as well as looking at the publicly disclosed Lakefield laptops coming to market), die shots, supposed performance numbers, thermal innovations, and the future for Lakefield.


About the Author

Thomas De Maesschalck

Thomas has been messing with computer since early childhood and firmly believes the Internet is the best thing since sliced bread. Enjoys playing with new tech, is fascinated by science, and passionate about financial markets. When not behind a computer, he can be found with running shoes on or lifting heavy weights in the weight room.



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