In this article, over the following pages, we'll be looking at Intel's new Lakefield processor in detail, covering the new multi-core design, discussing chiplets and Intel's new die-to-die bonding technology called Foveros, the implications of such a design on laptop size (as well as looking at the publicly disclosed Lakefield laptops coming to market), die shots, supposed performance numbers, thermal innovations, and the future for Lakefield.
A deep dive into the Intel Lakefield
Posted on Tuesday, July 07 2020 @ 14:07 CEST by Thomas De Maesschalck