Intel shows Tiger Lake die shot at Hot Chips 2020

At the virtual Hot Chips 2020 conference, Intel presented a die shot of its new 10nm Tiger Lake mobile processor. Twitter user Locuza annotated the photo. Tiger Lake uses the Intel 10nm process with SuperFin technology transistors, it promises 15-20 percent more performance at the same voltages/clocks in some areas, and much higher peak clockspeeds.

Besides featuring the new Willow Cove architecture, Tiger Lake is also the first product with Intel's new Xe-based integrated graphics. The Xe graphics seem to make up about 33 percent of the chip's die area.

To the left-center of the die, we see four large orange clusters that appear to be the L1, L2, and L3 cache structures, with the rest of the cores extending to the top and bottom of the die. Further to the left, we spot the system agent and I/O interfaces. The ring agent in the center of the image connects the iGPU, caches/cores, and system I/O blocks. Intel brought Thunderbolt 4 mostly on-die with the original Ice Lake processors, and we can see that continue with the large dedicated die area in the upper right of the diagram.

Some quick annotations for the Tiger Lake die shot (Willow Cove CPU + Gen12/Xe LP graphics).
It has several differences in comparison to Gen11 but on a high level Intel uses a similar floor plan.

*sorry for the repost but the white background I forgot to remove bothered me ????* pic.twitter.com/zk53XCODQ0

— Locuza (@Locuza_) August 17, 2020

Via: Tom's Hardware