Posted on Friday, August 21 2020 @ 12:46 CEST by Thomas De Maesschalck
TSMC is hosting a technology forum on August 25. DigiTimes
reports the Taiwanese foundry will discuss its 2nm and 3nm process nodes, as well as advanced 3D heterogeneous integration technology, like SoIC (system-on-integrated chips) packaging technology.
TSMC is going to disclose more about the development of its sub-3nm manufacturing processes and SoIC at its upcoming technology forum on August 25. The foundry is building 3nm fabricaion lines at the Southern Taiwan Science Park, and it has acquired substantial amounts of facilities there, the latest being a plant from E-Ton Solar. Nan Ya PCB has delivered samples of SiP substates to clients for processing 5nm chips, and volume shipments may begin by the end of 2020.
