TSMC has 50 percent of all EUV machines and 60 percent of EUV wafer production

Posted on Friday, August 28 2020 @ 21:34 CEST by Thomas De Maesschalck
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At its technology symposium earlier this week, Taiwanese foundry TSMC shared some statistics about its lead in EUV manufacturing. TSMC estimates it has about 50 percent of the global EUV install base. Furthermore, the foundry calculated that it has produced about 60 percent of all wafers made using EUV technology. Further details at AnandTech.
Current known public EUV processes from the big fabs include TSMC’s 7+ and N5, as well as Samsung’s 7LPP (and anything below), with Intel’s EUV efforts only entering in its own 7nm portfolio next year. Anything beyond these processes at the leading edge will continue to extend EUV use. EUV machines typically have a lower throughput, anywhere from 120-175 wafers per hour, than regular DUV machines which can reach 275 wph on the latest versions, however since 1 layer of EUV typically replaces 3-4 layers of DUV, the throughput is higher, but nonetheless the desire to scale out to multiple EUV machines to increase the physical number of wafers is a keen target for these foundries.
TSMC EUV production stats

About the Author

Thomas De Maesschalck

Thomas has been messing with computer since early childhood and firmly believes the Internet is the best thing since sliced bread. Enjoys playing with new tech, is fascinated by science, and passionate about financial markets. When not behind a computer, he can be found with running shoes on or lifting heavy weights in the weight room.

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