Posted on Friday, August 28 2020 @ 21:34 CEST by Thomas De Maesschalck
At its technology symposium earlier this week, Taiwanese foundry TSMC shared some statistics about its lead in EUV manufacturing. TSMC estimates it has about 50 percent of the global EUV install base. Furthermore, the foundry calculated that it has produced about 60 percent of all wafers made using EUV technology. Further details
at AnandTech.
Current known public EUV processes from the big fabs include TSMC’s 7+ and N5, as well as Samsung’s 7LPP (and anything below), with Intel’s EUV efforts only entering in its own 7nm portfolio next year. Anything beyond these processes at the leading edge will continue to extend EUV use. EUV machines typically have a lower throughput, anywhere from 120-175 wafers per hour, than regular DUV machines which can reach 275 wph on the latest versions, however since 1 layer of EUV typically replaces 3-4 layers of DUV, the throughput is higher, but nonetheless the desire to scale out to multiple EUV machines to increase the physical number of wafers is a keen target for these foundries.
