Current known public EUV processes from the big fabs include TSMC’s 7+ and N5, as well as Samsung’s 7LPP (and anything below), with Intel’s EUV efforts only entering in its own 7nm portfolio next year. Anything beyond these processes at the leading edge will continue to extend EUV use. EUV machines typically have a lower throughput, anywhere from 120-175 wafers per hour, than regular DUV machines which can reach 275 wph on the latest versions, however since 1 layer of EUV typically replaces 3-4 layers of DUV, the throughput is higher, but nonetheless the desire to scale out to multiple EUV machines to increase the physical number of wafers is a keen target for these foundries.
TSMC has 50 percent of all EUV machines and 60 percent of EUV wafer production
Posted on Friday, August 28 2020 @ 21:34 CEST by Thomas De Maesschalck